The outstanding performance of the KR2266V2 full-stack AI in storage scenarios is attributed to its patented three-layer pull-out design for the drive bay. The server supports 28 3.5-inch drives, increasing storage density by 133% compared to the industry average. The design optimizes the drive tray, reshapes the 2U three-layer space architecture, introduces an innovative mortise and tenon frame structure, upgrades the die-casting component structure, and innovates the roller slide rail pull-out mechanism, which is all designed for storage performance improvement. To maintain signal integrity, the drive bay eliminates cable, adopts on-board routing, and utilizes an I/O board design. From components to the system, the KR2266V2 full-stack ensures stability and reliability in all aspects. This includes disrupting traditional vertical backplane design by adopting a flat drive backplane design, which reduces air resistance and ensures more stable drive operation. By suppressing resonance, improving fans, and implementing a vibration buffering design, it enhances drive performance by over 17%. Furthermore, the drive tray structure adopts an integrated metal casting design, meeting the product's structural reliability requirements. It has undergone an authoritative institution's Level 9 seismic resistance testing and adopts a design that ensures high-reliability service operation through derating and tuning.
In response to the essential need for data security, the KR2266V2 full-stack AI has undergone multiple optimizations in terms of the overall design, protection mechanisms, and feature settings. Through the built-in PFR protection mechanism, firmware can self-repair from malicious attacks. It supports one-click secure data erasure to prevent information leakage and provides support for TPM/TCM trusted modules, ensuring customer data and asset security. With BIOS/BMC chip-level redundancy design, it avoids flash software and hardware damage, ensuring that the entire startup or upgrade process is secure and reliable.
Comprehensive intelligent management, cloud-based monitoring, and one-click deployment
In response to the intelligent and efficient O&M requirements of hyper-scale data centers, the KR2266V2 full-stack AI has established an intelligent control platform. Through one-click Call-home, devices can be reported for repair within seconds, significantly reducing fault locating time with an intelligent diagnose accuracy rate of over 95%. It can also predict drive failures 5 to 30 days in advance and detect drive performance anomalies 5 to 10 minutes in advance. By proactively warning against potential issues, it minimizes the impact of equipment risks, ensuring service continuity. Through intelligent memory health analysis, fault prediction, and self-healing, the system's downtime rate is 69% lower than the industry average.
In addition, in pursuit of sustainable development goals to reduce carbon emissions and achieve energy efficiency, the KR2266V2 full-stack AI possesses intelligent environmental sensing capabilities. It enhances cooling efficiency by 10% through ultra-wide heatsinks and aviation-grade counter-rotating twin rotor fans. It also has efficient fan control algorithms and an industry-leading dual-sensor design for temperature and pressure, ensuring quick and precise fan response for temperature control and allowing for personalized thermal regulation.
In conclusion, the KR2266V2 full-stack AI achieves maximum storage density in a 2U space. It has made significant advances in storage density, computing power, network bandwidth, and intelligent management. It features a balanced and symmetrical system architecture that increases data capacity, throughput, and data processing capabilities. It is suitable for scenarios such as big data, content delivery networks (CDNs), and distributed storage.